Plastic Foam Module Wafer Carrier for Multi Wafer up to 6" (SP4-18060T/T)

Plastic Foam Module Wafer Carrier for Multi Wafer up to 6" (SP4-18060T/T)Plastic Foam Module Wafer Carrier is a solution for valued and fragile devices. This packing is designed to protect delicate parts during transport, processing, inspection and assembly. It has also been applied in many fields like optical materials, opto electronic components, semiconductor, and optical communication. The inner foam and outer foam are both made with anti static IXPE Conductive Foam. The top plastic case is made with polycarbonate,

Pricing is for one piece

and other powders

Parts should not be placed directly onto the inside surface of a hot furnace tube increase thermal shock

0 MHz (fixed)

Cap contains a PTC thermister

Carrier Concentration (@77 K)                     (0

< 4 x 104 /cm2

we strongly recommend to press powder with a professional laboratory hydraulic press to ensure the evenest pressing interface and uniform pressure force

1 sides polished

MTI changed the software for better operation

we strongly recommend you use the professional laboratory hydraulic pressers which ensure the most even pressing interface and uniform pressure force

SrTiO3 single crystal provides a good lattice match to most materials with Perovskite structure